Corns are small lumps of thickened, hardened skin that occur due to friction or pressure on an area of the foot. They are most often located in between the toes, on top of the toes, or on the soles of the feet. Corns can be uncomfortable or even painful, but non-surgical treatment is usually successful. Most of these treatments work by off-loading, or taking the pressure off of, the corn. Your doctor may ask you to wear a padded corn sleeve over the corn if it is located on your toe. If the corn is located between the toes, you may be asked to wear a toe spacer between the affected toes to take pressure and friction off the corn. A corn donut, which is a padded, donut-shaped device, can be placed around the corn to off-load it. If it is associated with a large callus, your doctor can also trim the corn. If you suffer from painful foot corns, please schedule an appointment with a podiatrist near you.
Corns can make walking very painful and should be treated immediately. If you have questions regarding your feet and ankles, contact Dr. John P. Beaupied of Palos Podiatry. Our doctor will treat your foot and ankle needs.
Corns: What Are They? And How Do You Get Rid of Them?
Corns are thickened areas on the skin that can become painful. They are caused by excessive pressure and friction on the skin. Corns press into the deeper layers of the skin and are usually round in shape.
Ways to Prevent Corns
There are many ways to get rid of painful corns such as:
- Wearing properly fitting shoes that have been measured by a professional
- Wearing shoes that are not sharply pointed or have high heels
- Wearing only shoes that offer support
Treating Corns
Although most corns slowly disappear when the friction or pressure stops, this isn’t always the case. Consult with your podiatrist to determine the best treatment option for your case of corns.
If you have any questions please feel free to contact our office located in Palos Heights, IL . We offer the newest diagnostic and treatment technologies for all your foot and ankle needs.